FIRST-PRINCIPLE DESIGN

Safety is a system, not a checklist.

Battery control architectures designed around real operating conditions, not ideal laboratory assumptions.

Assembled Webber battery management board

TAP TO EXPLODE

1COMPONENT LAYER
2COPPER CIRCUIT
3DIELECTRIC
4ALUMINIUM METAL CORE

SYSTEM ARCHITECTURE

From cell measurement to fleet decision.

CELLS
16S to 32S packs, 12V to 1200V systems.
mV
SENSING
Cell voltage, pack current and temperature channels.
ANALOG
DECISION LAYER/ WEBBER
State of charge and power, charging control, fault logic.
FIRMWARE
PROTECTION + BALANCING/ WEBBER
Over/under voltage, over-current, short circuit, open wire. Up to 400 mA balancing.
MOSFET / CONTACTOR
VEHICLE / STORAGE CONTROLLER
Isolated CAN across the low- to high-voltage boundary.
ISOLATED CAN

01 / BATTERY PARALLELING

Paralleling without CAN dependency.

THE PROBLEM: Swappable packs can have meaningful state-of-charge differences.
THE APPROACH: A proprietary paralleling architecture that does not depend on inter-pack CAN communication.
THE SYSTEM ADVANTAGE: Simpler swapping architecture and uninterrupted power delivery.

Proprietary architecture

Two battery packs connected through a shared power bus with no inter-pack CAN connection

02 / CHARGING CONTROL

Charge with the cell state, not only the pack voltage.

THE PROBLEM: Voltage-only charging leaves capacity on the table and stresses outlier cells.
THE APPROACH: Enhanced charging algorithms with charging-profile control and balancing interventions during charge.
THE SYSTEM ADVANTAGE: Enhanced usable capacity: the pack actually reaches full charge.

Proprietary algorithm

03 / HIGH-CURRENT BALANCING

Faster cell equilibrium. More usable pack performance.

THE PROBLEM: Low balancing currents leave large packs permanently out of equilibrium.
THE APPROACH: Industry-leading balancing current (up to 400 mA) with dedicated balancing algorithms.
THE SYSTEM ADVANTAGE: Faster equilibrium across the pack and more usable capacity per cycle.

Proprietary method

04 / METAL-CORE THERMAL ARCHITECTURE

Heat moves through the design, not into the failure mode.

THE PROBLEM: High-current BMS hardware concentrates heat into MOSFETs and shunts.
THE APPROACH: Metal-core PCB construction that spreads and extracts heat structurally.
THE SYSTEM ADVANTAGE: 2× better thermal performance and extended peak performance under sustained load.

Patented

Thermal bench comparison: an FR-4 board running hot beside a cooler metal-core board, with both thermal maps on the camera monitor

05 / ISOLATION + MONITORING

High-voltage aware by design.

THE PROBLEM: High-voltage systems fail unsafely when isolation is an afterthought.
THE APPROACH: Insulation monitoring, isolated CAN communication and clear low-voltage/high-voltage boundaries.
THE SYSTEM ADVANTAGE: Industry-first isolation features with temperature-based early detection of thermal runaway.

Industry-first feature set

Low-voltage and high-voltage BMS domains separated by an isolation barrier with isolated CAN and insulation monitoring

COMPLIANCE

Engineered for certification.
Validated for deployment.

AIS 156 / PHASE 2

WBMS-SW 16S/24S certified variants

Applicable variants: WBMS-SW 16S / 24S (certified configuration)
Functional scope: µSD card and buzzer integration per AIS 156 PH-2
Test laboratory: —
Certificate reference: —

VALIDATION

Designed at the bench.
Proven in the field.

Every design passes through thermal, abuse, vibration and environmental testing, hardware-in-loop validation, production end-of-line testing, and 100K+ systems of field data feed back into the next revision.

THERMAL TESTING
DEAD-SHORT TESTING
VIBRATION
ENVIRONMENTAL CYCLING
HARDWARE-IN-LOOP VALIDATION
PRODUCTION END-OF-LINE TESTING

SOFTWARE + DATA

Edge decisions in milliseconds.
Fleet insight over millions of events.

Firmware makes protection decisions at the edge. System health streams to the cloud, where fault detection and trend analysis run today, with predictive-maintenance models in development for BESS.

Bring us the operating envelope.

Voltage. Current. Packaging. Thermal constraints. Communication. Certification. Deployment volume.

Speak with the engineering team